Before you start the repair process, make sure that the phone's battery is under 25% charge.
Turn off the phone.
Remove the SIM tray.
Start by heating the back of the device with heating gun, this will soften the glue holding the back cover.
A hair dryer, or a hot plate may also be used, but be careful not to overheat the phone—the OLED display and internal battery are both susceptible to heat damage.
Slide in the flat metal spudger (the blade) between the back glass and the frame of the phone.
Carefully slice through the glue with the blade all around the edge of the rear glass panel.
You may need to reheat the back cover using the heating gun multiple times since the glue hardens quickly.
Due to the curved glass, you will be pushing the tool up, rather than inserting parallel to the plane of the phone.
Note: Try using the suction cup to help you lift the glass.
The adhesive on the rear case is laid out as seen in the first image.
The prying pattern as seen from the outside of the phone is as follows:
RED: Thick portions of adhesive.
ORANGE: Thin areas of adhesive.
YELLOW: Avoid prying near the fingerprint sensor.
The fingerprint sensor cable connects the phone to the rear glass near the main camera. The cable is very short and should disconnect as the rear glass is removed.
As you lift the glass, peek in to be sure the orange cable with a blue connector has disconnected.
If the fingerprint sensor cable seems snagged or stays taut do not open the phone any further. Disconnect the connector with the point of a spudger before proceeding.
Remove the glass from the phone.
Remove eleven 3.7 mm screws.
Remove the plastic piece that covers the motherboard along side the NFC antenna and charging coil assembly.
You should disconnect the battery as early as possible in the repair process.
Use the flat end of a spudger to disconnect the battery connector.
With the flat end of the plastic spudger disconnect the sensor array connector.
Disconnect the front camera connector.
Disconnect the LCD digitizer connector.
Remove the plastic piece that covers the bottom daughter board.
Remove six 2.5mm screws holding the daughter board.
Carefully lift the motherboard minding the surrounding connectors.
Disconnect the motherboard from the daughterboard and remove it from the device.
At this step we shall remove other parts from the device, like the front camera, vibration motor etc.
Start by removing the front camera.
Carefully remove the front camera from the cavity with a plastic spudger or tweezers.
Remove the previously disconnected headphone jack.
With utmost attention remove the delicate antenna cables from the brackets.
Now you can remove the daughterboard.
The charging port and the microphone are soldered to the daughter board.
This step requires caution, due to risk of explosion and fire.
Use the spudger to lift the battery paying attention not to puncture or deform the battery.
We do not recommend heating the battery to soften the glue, use glue dissolving solution instead.
If you cannot aquire a glue remover, keep carefully prying the battery.
After you succesfully removed the battery, carefully clean it from glue residue.
It is now time to transfer all previously removed parts to the new screen assembly.
Compare the old and the new LCD assebly to make sure that the new screen will fit all the parts we have previously removed.
Remove all the protective plastic foils from the new screen assembly except the one protecting the front glass.
Note: We are using the assembly which contains the LCD and the middle frame.
Put the daugther board into the new screen assembly.
Align it carefully so that the charging port slides into the cavity of the middle frame.
Secure two antenna cables into brackets.
Install the headphone jack and connect the flat cable to the daughter board.
Now insert the button shaped vibration motor into the cutout on the top part of the frame.
Next, the front sensor array should be placed into the top right cavity as shown on the photo.
The front camera goes into the top left corner of the middle frame.
Connect the motherboard to the daughterboard.
Now, slowly put it into the frame.
Pay attention to connections for the digitizer, camera and sensors.
Connect the sensor array connector to the motherboard (top right).
Connect the front camera connector to the motherboard (top left).
Connect the digitizer to the motherboard (bottom left).
Finally, connect the antennas to the motherboard.
Use the double sided tape to secure the battery.
Insert the battery into the frame and gently press.
Connect it with the board near the vibration motor.
Warning: The battery should always be connected last. Use only plastic tools to connect the battery.
Secure the daughter board with 6 screws you previously removed.
Install the black plastic cover on top of the daughterboard.
Now, the left middle piece, secure it immediately with the screw.
Next the NFC and the charging coil.
Make sure that everything pops in place.
Install the remaining 10 3.7mm screws.
At this point you should turn on the phone to make sure that everything works as it should.
Always test your repair before installing new adhesive and resealing the phone.
You can use new back cover if the old one is damaged.
In this case the old one will be reused.
If you reinstall the old back cover you need to remove all adhesive residue and debris from the back cover.
You can make it easier by heating the cover a little with the hot air gun.
Do not use metal tools as they will scratch the back cover's coating.
Since the glue is soften with the heat gun, remove the fingerprint sensor from the back cover.
Then place it in the cutout near the back camera and connect it to the motherboard.
Apply some B-7000 glue to the edges of the metal frame.
Position the back cover on top of the frame.
Put some clamps to ensure better adhesion, remove them after the glue dries.
Note: Be aware that your device lost its water ingress protection properties.
Warning: Allow glue to dry for up to 48 hours, cure time increases with lower temperatures and decreases with higher temperatures.
Information: B-7000 hardens by solvent evaporation and forms an immediate bond that is difficult to reposition after both adhesive-coated surfaces are placed in contact with each other and sufficient pressure is exerted to establish full contact.